RO4003C 4-Layer 1.8mm Thick PCB with ENIG Finish and Blind Vias

1.Introduction

Rogers RO4003C materials are proprietary woven glass-reinforced hydrocarbon/ceramic laminates that combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. These materials are ideal for high-frequency applications, offering tight control over dielectric constant (Dk) and low loss at a fraction of the cost of conventional microwave laminates. Unlike PTFE-based materials, RO4003C requires no special through-hole treatments, making it easier to process like standard FR-4 while delivering superior RF performance.

With a thermal coefficient of expansion (CTE) closely matched to copper, RO4003C ensures excellent dimensional stability, critical for mixed dielectric multi-layer boards. Its low Z-axis CTE enhances plated through-hole reliability, even under severe thermal shock conditions. The material's high Tg (>280°C) guarantees stability across all circuit processing temperatures.

2.Key Performance Features

Dielectric Constant (Dk): 3.38 ±0.05 at 10GHz
Dissipation Factor (Df): 0.0027 at 10GHz, 0.0021 at 2.5GHz
Thermal Conductivity: 0.71 W/m/°K
CTE: X: 11 ppm/°C, Y: 14 ppm/°C, Z: 46 ppm/°C
Low Moisture Absorption: 0.06%
Thermal Stability: Tg >280°C (536°F)

Benefits

Ideal for multi-layer RF/microwave designs
Cost-effective fabrication (FR-4 compatible processes)
Reliable performance in high-volume applications

3.PCB Specifications at a Glance

4.PCB Stackup: 3-layer rigid PCB

5.PCB Statistics:

Components: 32
Total Pads: 141
Thru Hole Pads: 73
Top SMT Pads: 68
Bottom SMT Pads: 0
Vias: 37
Nets: 5

6.Typical Applications

Cellular Base Station Antennas
RF Identification Tags
Automotive Radar/Sensors
Satellite LNB Circuits

7.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support